发明名称 |
ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD |
摘要 |
In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.
|
申请公布号 |
US2013047427(A1) |
申请公布日期 |
2013.02.28 |
申请号 |
US201213578364 |
申请日期 |
2012.03.02 |
申请人 |
YAGI SHUZO;TAMURA TAKASHI;YAMAMOTO HIROKI;IKEDA TORU;KISHIKAWA KAZUHIRO;PANASONIC CORPORATION |
发明人 |
YAGI SHUZO;TAMURA TAKASHI;YAMAMOTO HIROKI;IKEDA TORU;KISHIKAWA KAZUHIRO |
分类号 |
H05K13/04;H05K3/30 |
主分类号 |
H05K13/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|