发明名称 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.
申请公布号 US2013047427(A1) 申请公布日期 2013.02.28
申请号 US201213578364 申请日期 2012.03.02
申请人 YAGI SHUZO;TAMURA TAKASHI;YAMAMOTO HIROKI;IKEDA TORU;KISHIKAWA KAZUHIRO;PANASONIC CORPORATION 发明人 YAGI SHUZO;TAMURA TAKASHI;YAMAMOTO HIROKI;IKEDA TORU;KISHIKAWA KAZUHIRO
分类号 H05K13/04;H05K3/30 主分类号 H05K13/04
代理机构 代理人
主权项
地址