| 摘要 |
PROVIDED IS A METHOD FOR CUTTING A WAFER INTO SMALL CHIPS WITH HIGH SECURITY AND A CUTTING APPARATUS SUITABLE TO THIS CUTTING METHOD. ACCORDING TO THE WAFER CUTTING METHOD AND CUTTING APPARATUS FOR CUTTING THE WAFER (1) PASTED ON THE SHEET (3) ALONG THE PLANNED CUTTING LINES (2) IN THE LATTICE PATTERN, THE TOP SURFACE OF THE CUTTING APPARATUS (10) IS SLID UNDER THE BOTTOM SURFACE OF THE SHEET (3), AND THE SHEET (3) IS LOCALLY VACUUM SUCTIONED THROUGH THE VACUUM SUCTION INLETS (13) ALIGNED ON THE TOP SURFACE. THE VACUUM SUCTION ALLOWS BENDING STRESS TO BE INTENSIVELY APPLIED ON ONE OF THE PLANNED CUTTING LINES (2) OF THE WAFER (1) SO AS TO CUT THE WAFER (1) ALONG THE PLANNED CUTTING LINE (2). |
