| 摘要 |
PURPOSE: A power amplifying circuit for packaging a semiconductor is provided to control power transmitted to a microelectronic element by preventing the drop of a power supply voltage level. CONSTITUTION: A microelectronic element(102) outputs a logic signal of a discrete value. The logic signal of the discrete value shows that an increasing demand for a current by a part of the microelectronic element is estimated. An active power delivery element(106) of a microelectronic package(100) is operated by the logic signal to increase currents supplied to the microelectronic element and includes an active device that is a transistor with a current path. A silicon interposer includes an active element of the active power delivery element. [Reference numerals] (102) Integrated circuit; (104) Power supply; (106) Power delivery element |
