| 摘要 |
The device (100) has a process control (121) for controlling a device for cleaning and rinsing processes so that a supply of a process fluid is provided from a fluid supply nozzle (6) for a rear surface of a substrate (W) e.g. semiconductor wafer. A fluid film is formed on the rear surface of the substrate, and the supply of a process fluid from the nozzle is interrupted and is set into a channel. The fluid film is formed on a section around a fluid guide opening (24a) so that the section and the substrate are processed. Independent claims are also included for the following: (1) a method for cleaning a substrate (2) a computer readable medium comprising instructions to perform a cleaning method. |
