发明名称 SAWING DEVICE FOR LED MATERIAL AND METHOD FOR SAWING LED MATERIAL
摘要 PURPOSE: A sawing device for led materials and a method for sawing the same are provided to improve the precision of a sawing process by using a chuck table. CONSTITUTION: A blade saws an LED material. A chuck table includes a mounting portion(230) and a main block(210,220). The LED material is mounted on the mounting portion. The main block supports the mounting portion. A cooling unit cools the LED material mounted on the mounting portion.
申请公布号 KR20130020020(A) 申请公布日期 2013.02.27
申请号 KR20110082372 申请日期 2011.08.18
申请人 HANMISEMICONDUCTOR CO., LTD. 发明人 LIM, JAI YOUNG
分类号 H01L21/301;H01L33/00 主分类号 H01L21/301
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