| 摘要 |
<p>According to an exemplary embodiment, a small-outline package includes a power transistor having a source and a drain, the power transistor situated on a paddle of a leadframe of the small-outline package. The source of the power transistor is electrically connected to a plurality of source leads. The drain of the power transistor is electrically and thermally connected to a top side of the paddle of the leadframe, the paddle of the leadframe being exposed from a bottom surface of the small-outline package, thereby providing a direct electrical contact to the drain from a bottom side of the paddle of the leadframe.</p> |
