THERMOELECTRIC MODULE AND MANUFACTURING METHOD FOR THEREMOELECTRIC MODULE
摘要
PURPOSE: A thermoelectric module and a method for manufacturing thermoelectric module are provided to prevent cracks between interfaces without using a ceramic substrate. CONSTITUTION: A metallic board(110) is combined with a P-type thermoelectric element(151) and an N type thermoelectric element(152). The metallic board is made of copper. A bonding device is prepared between the metallic board and the P-type thermoelectric element or the N type thermoelectric element. An insulating layer is formed on the surface of the P-type thermoelectric element, the N type thermoelectric element and the metallic board.
申请公布号
KR20130019883(A)
申请公布日期
2013.02.27
申请号
KR20110082166
申请日期
2011.08.18
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, SUNG HO;CHOI, DONG HYEOK;HUR, KANG HEON;YANG, JU HWAN