发明名称 THERMOELECTRIC MODULE AND MANUFACTURING METHOD FOR THEREMOELECTRIC MODULE
摘要 PURPOSE: A thermoelectric module and a method for manufacturing thermoelectric module are provided to prevent cracks between interfaces without using a ceramic substrate. CONSTITUTION: A metallic board(110) is combined with a P-type thermoelectric element(151) and an N type thermoelectric element(152). The metallic board is made of copper. A bonding device is prepared between the metallic board and the P-type thermoelectric element or the N type thermoelectric element. An insulating layer is formed on the surface of the P-type thermoelectric element, the N type thermoelectric element and the metallic board.
申请公布号 KR20130019883(A) 申请公布日期 2013.02.27
申请号 KR20110082166 申请日期 2011.08.18
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, SUNG HO;CHOI, DONG HYEOK;HUR, KANG HEON;YANG, JU HWAN
分类号 H01L35/02 主分类号 H01L35/02
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