HEATED SEMICONDUCTOR BONDING TOOL

摘要

A high-efficiency heated bonding tool having a heat sink with a plurality of recesses therein for receiving a replacable heating element and a bonding nib, at least one recess comprising a helical thread into which is fitted a helical coil heating element wound as a spring having a diameter which would cause an interference fit with the helical thread, but when flexed to fit the helical thread provides a radial force for tight surface-to-surface engagement with the helical thread.