| 摘要 |
PURPOSE: A semiconductor wafer chip test system including a picking apparatus is provided to increase inspection speed for a semiconductor chips by simultaneously transferring two semiconductor chips. CONSTITUTION: A wafer loader(100) gradually provides a wafer by mounting a wafer cassette including the wafer. A picking unit(120) simultaneously transfers two semiconductor chips using two nozzles. An index rail(200) moves the semiconductor chips by receiving the semiconductor chips through a chip mounting frame. A first test apparatus(220) tests one of the semiconductor chips which are moved through the index rail. A second test apparatus(240) tests another semiconductor chip which is not tested by the first test apparatus. [Reference numerals] (100) Wafer loader; (110) Wafer cassette; (120) Picking unit; (200) Index rail; (210) First chip arrangement unit; (220) First test apparatus; (230) Second chip arrangement unit; (240) Second test apparatus; (250) Pick up apparatus; (260) Transfer; (300) Pick up apparatus; (AA) Buffer stage; (BB) Wafer stage; (CC) Classification stage |
