| 摘要 |
FIELD: electrical engineering.SUBSTANCE: basic board contains multiple panel substrates and has thin silicon film formed on the board main surface; each panel substrate has a transistor formation area and an end area; the transistor formation area is formed by means of polycrystallisation of thin silicon film having the first crystal profile, the end area envisaged on the outer edge of each panel substrate. The panel substrates contain the first panel substrate having an end area with thin silicon film having the first crystal profile and the second panel substrate having an end area with thin silicon film having the second crystal profile; the thin silicon film forms the manufacture process control mark and/or evaluation template within the end area.EFFECT: invention allows to create a basic board having panel substrates efficiently configured thereon and a reduced area of substrate wasted.11 cl, 6 dwg |
