发明名称
摘要 The circuit connecting material of the invention is a circuit connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and second circuit electrode laid facing each other, the circuit connecting material comprising a curing agent that generates free radicals, a radical polymerizing substance and a compound containing secondary thiol group. The circuit connecting material of the invention is capable of low-temperature rapid curing and has excellent storage stability.
申请公布号 JP5152191(B2) 申请公布日期 2013.02.27
申请号 JP20090538971 申请日期 2008.08.29
申请人 发明人
分类号 H01L21/60;C09J4/00;C09J5/00;C09J9/02;C09J11/06;H01B1/22;H05K1/14;H05K3/32 主分类号 H01L21/60
代理机构 代理人
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