POWER SEMICONDUCTOR ARRANGEMENT, POWER SEMICONDUCTOR MODULE WITH MULTIPLE POWER SEMICONDUCTOR ARRANGEMENTS, AND MODULE ASSEMBLY COMPRISING MULTIPLE POWER SEMICONDUCTOR MODULES

摘要

PURPOSE: A power semiconductor array, a power semiconductor module including a plurality of power semiconductor arrays, and a module assembly including a plurality of power semiconductor modules are provided to improve heat transmission from a power semiconductor device in a circuit short fault mode. CONSTITUTION: A base plate(2) includes a molybdenum layer(4) and a metal mounting base(6). A power semiconductor device(3) is mounted on the upper side of the base plate and is electrically and thermally coupled with the base plate. A pressing pin(7) is arranged near the power semiconductor device in an opposite side to the base plate. The metal mounting base is arranged between the semiconductor device and the molybdenum layer.