| 摘要 |
1,172,332. Semi-conductor devices. FORBRO DESIGN CORP. 10 June, 1968 [15 June, 1967], No. 27493/68. Heading H1K. A heat sink of U-channel form on which semiconductor devices may be mounted has a plurality of parallel heat dissipating fins 4, 5, 6 mounted on the edges of the channel walls, the fins being of sheet metal and being slotted to form lips in good thermal contact with the channel walls. Tabs formed on the fins during their manufacture serve to position them relative to one another and being adjacent to and in contact with the channel also serve to increase the thermal coupling between it and the fins. A circulation of fluid coolant such as air driven by fan 48, 49, cools the components on the heat sink. These components may be either directly mounted in holes 32-37 on the sink or may be on a circuit board 28, 29 attached to and spaced from the channel walls by means of stand-off studs 30, 31. The heat sink may be made of copper. In an alternative arrangement, Fig. 8, not shown, there may be fins mounted on both ends of the U-channel. |
