发明名称 Light emitting device and light emitting device package
摘要 A light emitting device according to the embodiment includes a support substrate; a first light emitting structure disposed on the support substrate and including a first conductive type first semiconductor layer, a first active layer under the first conductive type first semiconductor layer, and a second conductive type second semiconductor layer under the first active layer; a first reflective electrode under the first light emitting structure; a first metal layer around the first reflective electrode; a second light emitting structure disposed on the support substrate and including a first conductive type third semiconductor layer, a second active layer under the first conductive type third semiconductor layer, and a second conductive type fourth semiconductor layer under the second active layer; a second reflective electrode under the second light emitting structure; a second metal layer around the second reflective electrode; and a contact part making contact with an inner portion of the first conductive type first semiconductor layer of the first light emitting structure and electrically connected to the second reflective electrode.
申请公布号 EP2562815(A2) 申请公布日期 2013.02.27
申请号 EP20120151102 申请日期 2012.01.13
申请人 LG INNOTEK CO., LTD. 发明人 JEONG, HWAN HEE
分类号 H01L27/15;H01L25/075;H01L33/38 主分类号 H01L27/15
代理机构 代理人
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