| 发明名称 |
Lead frame design to improve reliability |
| 摘要 |
An electronic device package 100 comprising a lead frame 105 having at least one lead 110 with a notch 205. The notch includes at least one reentrant angle 210 of greater than 180 degrees and the notch is located distal to a cut end 1010 of the lead. |
| 申请公布号 |
EP2284886(A3) |
申请公布日期 |
2013.02.27 |
| 申请号 |
EP20100165969 |
申请日期 |
2010.06.15 |
| 申请人 |
LSI CORPORATION |
发明人 |
GOLICK, LARRY W.;LOW, QWAI HOONG;OSENBACH, JOHN W.;STAHLEY, MATTHEW E. |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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