发明名称 |
Cross-section systems and methods |
摘要 |
A first instrument (230) is used to image a first semiconductor article having a trench (110) of defined cross-section, while a second instrument (220) is used to simultaneously prepare a second semiconductor article with a trench of defined cross-section. Furthermore, a method is disclosed to prepare a trench (110) of defined cross-section in a semiconductor article by rough milling and subsequent fine milling.
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申请公布号 |
US8384029(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US20090994344 |
申请日期 |
2009.06.16 |
申请人 |
CARL ZEISS NTS, LLC;KNIPPELMEYER RAINER;SCIPIONI LAWRENCE;RIEDESEL CHRISTOPH;MORGAN JOHN;MANTZ ULRICH;WAGEMANN ULRICH |
发明人 |
KNIPPELMEYER RAINER;SCIPIONI LAWRENCE;RIEDESEL CHRISTOPH;MORGAN JOHN;MANTZ ULRICH;WAGEMANN ULRICH |
分类号 |
G01N1/28;G01N23/00;H01L21/44 |
主分类号 |
G01N1/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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