发明名称 |
Methods of processing a thermal interface material |
摘要 |
Methods are disclosed to process a thermal interface material to achieve easy pick and placement of the thermal interface material without lowering thermal performance of a completed semiconductor package. One method involves applying a non-adhesive layer on one or more surfaces of the thermal interface material, interfacing the thermal interface material with one or more components to interface the non-adhesive layer therebetween, and applying heat to alter the non-adhesive layer to increase thermal contact between the thermal interface material and the interfacing component(s).
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申请公布号 |
US8383459(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US20080145364 |
申请日期 |
2008.06.24 |
申请人 |
INTEL CORPORATION;SUPRIYA LAKSHMI;WENINGER JESSICA;ARANA LEONEL;MUSTAPHA LATEEF |
发明人 |
SUPRIYA LAKSHMI;WENINGER JESSICA;ARANA LEONEL;MUSTAPHA LATEEF |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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