SURFACE TREATMENT METHOD OF PRINTED CIRCUIT BOARD

摘要

PURPOSE: A surface processing method for a printed circuit board is provided to improve the efficiency of a manufacturing process by reducing facility space through applying series processing which is not a batch type. CONSTITUTION: A printed circuit board comprises an insulating layer. The printed circuit board forms a micro circuit pattern. A junction part of anisotropic conductive film is formed at the insulating layer. The insulating layer performs a desmear process which is using permanganate etchant. The desmear process is implemented in the temperature of 60 to 95°C for less than seven minutes.