Thermal interface material and semiconductor component including the thermal interface material

摘要

A thermal interface material for use in manufacturing a semiconductor component and a method for manufacturing the semiconductor component. The thermal interface material includes a metallic element in combination with either antimony or tin. Suitable metallic elements include gallium or indium. The concentration of antimony or tin is about 2 percent or less by weight of the thermal interface material. A semiconductor chip is mounted to a support substrate and the thermal interface material is disposed on the semiconductor chip. A lid or a heatsink is coupled to the semiconductor chip via the thermal interface material.