发明名称 Nitride semiconductor device and method of manufacturing the same
摘要 A nitride semiconductor device including: a substrate; a nitride semiconductor layer formed on the substrate and having a heterojunction interface; and a recess portion formed on the nitride semiconductor layer, wherein the nitride semiconductor layer includes: a carrier transit layer, which has a composition represented by the formula: Alx1Inx2Ga1&minus;x1&minus;x2N, (0&nlE;x1&nlE;1, 0&nlE;x2&nlE;1, 0&nlE;(x1+x2)&nlE;1); and a carrier supply layer including: a first layer formed on the carrier transit layer, said first layer having a composition represented by the formula: AlyGa1&minus;yN, (0<y&nlE;1, x1<y); a second layer formed on the first layer, said second layer containing GaN; and a third layer formed on the second layer, said third layer having a composition represented by the formula: AlzGa1&minus;zN, (0<z&nlE;1, x1<z), and wherein the recess portion is formed to penetrate the third layer and expose a surface of the second layer at a bottom portion of the recess portion.
申请公布号 US8384089(B2) 申请公布日期 2013.02.26
申请号 US201113030443 申请日期 2011.02.18
申请人 SANKEN ELECTRIC CO., LTD.;SATO KEN 发明人 SATO KEN
分类号 H01L29/778;H01L21/20;H01L21/30 主分类号 H01L29/778
代理机构 代理人
主权项
地址