发明名称 |
Electrical connector system |
摘要 |
A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.
|
申请公布号 |
US8382522(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US201113191695 |
申请日期 |
2011.07.27 |
申请人 |
TYCO ELECTRONICS CORPORATION;GLOVER DOUGLAS W.;HELSTER DAVID W.;MINNICK TIMOTHY R.;MORGAN CHAD W.;WICKES EVAN C. |
发明人 |
GLOVER DOUGLAS W.;HELSTER DAVID W.;MINNICK TIMOTHY R.;MORGAN CHAD W.;WICKES EVAN C. |
分类号 |
H01R13/648 |
主分类号 |
H01R13/648 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|