| 发明名称 |
Patch on interposer through PGA interconnect structures |
| 摘要 |
Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a top surface of the interposer; and attaching a flex connector to the at least one interconnect structure.
|
| 申请公布号 |
US8381393(B2) |
申请公布日期 |
2013.02.26 |
| 申请号 |
US20090655406 |
申请日期 |
2009.12.30 |
| 申请人 |
INTEL CORPORATION;ROBERTS BRENT M.;ROY MIHIR K.;SRINIVASAN SRIRAM;NARASIMHAN SRIDHAR |
发明人 |
ROBERTS BRENT M.;ROY MIHIR K.;SRINIVASAN SRIRAM;NARASIMHAN SRIDHAR |
| 分类号 |
H01K3/10 |
主分类号 |
H01K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
