Bonding a solder bump to a lead using compression and retraction forces
摘要
Methods of connecting solder bumps located on dies to leads located on substrates are disclosed herein. One embodiment includes applying a first compression force between the solder bump and the lead; relieving the first compression force between the solder bump and the lead; and applying a second compression force between the solder bump and the lead.
申请公布号
US8381967(B1)
申请公布日期
2013.02.26
申请号
US201213343941
申请日期
2012.01.05
申请人
TEXAS INSTRUMENTS INCORPORATED;MASUMOTO MUTSUMI;BAUTISTA, JR. JESUS BAJO;PARTOSA RAYMOND MALDAN;BAELLO JAMES RAYMOND
发明人
MASUMOTO MUTSUMI;BAUTISTA, JR. JESUS BAJO;PARTOSA RAYMOND MALDAN;BAELLO JAMES RAYMOND