发明名称 plasma etching apparatus
摘要 PURPOSE: A substrate processing device and a method thereof are provided to install a magnet unit on the outside of a first electrode unit, thereby forming uniform plasma with high density. CONSTITUTION: A first electrode unit(161) is installed on the external wall of a housing. The first electrode unit receives a voltage from the outside. Magnet units(181,182) are installed on one side of the first electrode unit. The magnet units generate magnetic fields in the housing. A plasma source unit generates plasma using a processing gas.
申请公布号 KR101237400(B1) 申请公布日期 2013.02.26
申请号 KR20100013168 申请日期 2010.02.12
申请人 发明人
分类号 H01L21/3065 主分类号 H01L21/3065
代理机构 代理人
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