| 发明名称 |
Method of forming a semiconductor die |
| 摘要 |
In one embodiment, semiconductor die having non-rectangular shapes and die having various different shapes are formed and singulated from a semiconductor wafer.
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| 申请公布号 |
US8384231(B2) |
申请公布日期 |
2013.02.26 |
| 申请号 |
US20100689126 |
申请日期 |
2010.01.18 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC;GRIVNA GORDON M.;SEDDON MICHAEL J. |
发明人 |
GRIVNA GORDON M.;SEDDON MICHAEL J. |
| 分类号 |
H01L23/28 |
主分类号 |
H01L23/28 |
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