发明名称 Stack capacitor structure and forming method
摘要 The present invention discloses a stack capacitor structure and method of making the same. The top plate of the stack capacitor structure is connected to each other through a connecting node. The method of forming the stack capacitor structure includes providing an insulating substrate with a doped insulating material layer disposed therein. Then, the insulating substrate is patterned to form a trench, wherein an inner sidewall of the trench has a first region and a second region and the doped insulating material layer within the second region is entirely removed to form a hole. Later, a top plate is formed to surround the inner sidewall of the trench, and the top plate fills in the hole. Next, a capacitor dielectric layer is formed to surround the top plate. Finally, a storage node is formed to fill up the trench.
申请公布号 US8384191(B2) 申请公布日期 2013.02.26
申请号 US201113115116 申请日期 2011.05.25
申请人 NANYA TECHNOLOGY CORP.;KUAN SHIH-FAN 发明人 KUAN SHIH-FAN
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
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