发明名称 |
Light emitting diodes with enhanced thermal sinking and associated methods of operation |
摘要 |
Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
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申请公布号 |
US8384105(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US20100727943 |
申请日期 |
2010.03.19 |
申请人 |
MICRON TECHNOLOGY, INC.;TETZ KEVIN;WATKINS CHARLES M. |
发明人 |
TETZ KEVIN;WATKINS CHARLES M. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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