发明名称 |
Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display |
摘要 |
Disclosed herein is a substrate with chip mounted thereon, including: a solder pattern having a plan-view shape in which projected parts are projected radially from a central part; and a chip fixed in the state of being aligned to the central part of the solder pattern. |
申请公布号 |
US8384116(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US20090622639 |
申请日期 |
2009.11.20 |
申请人 |
SONY CORPORATION;OHTORII HIIZU;AOYAGI AKIYOSHI;TOMODA KATSUHIRO |
发明人 |
OHTORII HIIZU;AOYAGI AKIYOSHI;TOMODA KATSUHIRO |
分类号 |
H01L33/00;H01L23/40;H01L23/48;H01L23/52 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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