发明名称 Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display
摘要 Disclosed herein is a substrate with chip mounted thereon, including: a solder pattern having a plan-view shape in which projected parts are projected radially from a central part; and a chip fixed in the state of being aligned to the central part of the solder pattern.
申请公布号 US8384116(B2) 申请公布日期 2013.02.26
申请号 US20090622639 申请日期 2009.11.20
申请人 SONY CORPORATION;OHTORII HIIZU;AOYAGI AKIYOSHI;TOMODA KATSUHIRO 发明人 OHTORII HIIZU;AOYAGI AKIYOSHI;TOMODA KATSUHIRO
分类号 H01L33/00;H01L23/40;H01L23/48;H01L23/52 主分类号 H01L33/00
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