发明名称 |
RC delay detectors with high sensitivity for through substrate vias |
摘要 |
A die includes a plurality of through-substrate vias (TSVs) penetrating a substrate of the die, wherein the plurality of TSVs are grouped as a plurality of TSV pairs. A plurality of contact pads is coupled to the plurality of TSVs, wherein the plurality of contact pads is exposed on a first surface of the die. The die further includes a plurality of balanced pulse comparison units, wherein each of the plurality of balanced pulse comparison units includes a first input and a second input coupled to a first TSV and a second TSV of one of the plurality of TSV pairs. The die further includes a plurality of pulse latches, each including an input coupled to an output of one of the plurality of balanced pulse comparison units.
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申请公布号 |
US8384430(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US20100971204 |
申请日期 |
2010.12.17 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;TSENG NAN-HSIN;LIU CHIN-CHOU;CHANGCHIEN WEI-PIN;LIN PEI-YING;HUNG TA-WEN |
发明人 |
TSENG NAN-HSIN;LIU CHIN-CHOU;CHANGCHIEN WEI-PIN;LIN PEI-YING;HUNG TA-WEN |
分类号 |
H03K19/21;H03K17/00 |
主分类号 |
H03K19/21 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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