发明名称 |
Method and apparatus for thermal treatment of semiconductor workpieces |
摘要 |
The present invention provides an apparatus and method for rapid and uniform thermal treatment of semiconductor workpieces in two closely arranged thermal treatment chambers with a retractable door between them. The retractable door moves in between two thermal treatment chambers during heating or cooling process, and additional heating and cooling sources are provided for double-side thermal treatment of the semiconductor workpiece.
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申请公布号 |
US8383429(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US20100733436 |
申请日期 |
2010.06.01 |
申请人 |
ACM RESEARCH (SHANGHAI) INC.;MA YUE;HE CHUAN;PANG ZHENXU;WANG DAVID;NUCH VOHA |
发明人 |
MA YUE;HE CHUAN;PANG ZHENXU;WANG DAVID;NUCH VOHA |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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