发明名称 |
Substrate supporting unit, and apparatus and method for polishing substrate using the same |
摘要 |
Provided are a substrate supporting unit and an apparatus and method for polishing a substrate using the same. The substrate supporting unit vacuum-absorbs a bottom surface of the substrate during a polishing process, and supports the substrate in a state where the substrate is upwardly spaced from the substrate supporting unit to clean the substrate during a post-cleaning process. Therefore, in the substrate supporting unit and the apparatus and method for polishing the substrate using the same, a polishing process on a top surface of the substrate and a post-cleaning process on the top and bottom surfaces of the substrate may be sequentially performed in a state where the substrate is supported by a single wafer type substrate supporting unit.
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申请公布号 |
US8382555(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US20090591246 |
申请日期 |
2009.11.13 |
申请人 |
SEMES CO., LTD.;LEE TAEK YOUB |
发明人 |
LEE TAEK YOUB |
分类号 |
B24B1/00;B24B37/04;B24B37/30;H01L21/304 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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