Package including wires contacting lead frame edge

摘要

Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a lead frame including a major surface, and a die having including a bond pad. A wire may electrically couple a location of the major surface of the lead frame with the bond pad of the die, the wire being situated such that the wire is substantially unbent from the location of the major surface to an edge of the lead frame.