发明名称 |
Method and device for measuring inter-chip signals |
摘要 |
A method and device for measuring a signal of a die to be placed within a package is disclosed. At least one die as a Device Under Test (DUT) is mounted on a substrate and a chip-type measurement instrument is mounted on the substrate, or embedded into the substrate, wherein the instrument analyzes and/or processes the signal of the DUT and may provide stimulus signal to the DUT. The substrate having the DUT and the measurement instrument is mounted on a circuit board that has plural electrodes to be connected to the signal paths of the DUT and the instrument. An electrode is coupled to a standard interface port to provide the signal of the chip-type instrument to an external instrument.
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申请公布号 |
US8384411(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US20090642278 |
申请日期 |
2009.12.18 |
申请人 |
TEKTRONIX, INC.;MOOYMAN-BECK BART A.;WOOLHISER ROBERT J.;COSGROVE KEVIN E.;KNIERIM DANIEL G. |
发明人 |
MOOYMAN-BECK BART A.;WOOLHISER ROBERT J.;COSGROVE KEVIN E.;KNIERIM DANIEL G. |
分类号 |
G01R31/02 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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