LASER PROCESSING METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGES

摘要

PURPOSE: A method for processing a semiconductor package with laser is provided to accurately maintain each hole by preventing a contact failure between packages and connection between solder balls. CONSTITUTION: Laser is irradiated to a hole array. An irradiation interval is two pitches or more. A plurality of holes are formed over two pitches in a first irradiation stage. A first type hole forming stage includes a second irradiation stage(S130). A plurality of holes are formed with one pitch by irradiating laser in a second type hole forming stage(S140). [Reference numerals] (AA) Start; (BB) Is it expected that the additional collapse of a barrier part dividing between holes; (CC) End; (S120) Is a heat-affected zone overlapped area?; (S130) First type hole forming stage; (S140) Second type hole forming stage