发明名称 Etching method and recording medium
摘要 An etching method by which a fluorine-added carbon film formed on a substrate is etched by plasma includes a first step of etching the fluorine-added carbon film with plasma of an oxygen-containing processing gas, and a second step of etching the fluorine-added carbon film with plasma of a fluorine-containing processing gas.
申请公布号 US8383519(B2) 申请公布日期 2013.02.26
申请号 US20080526471 申请日期 2008.02.05
申请人 TOKYO ELECTRON LIMITED;NOZAWA TOSHIHISA;MIYATANI KOTARO;HORI TOSHIYASU;HIROSE SHIGEKAZU 发明人 NOZAWA TOSHIHISA;MIYATANI KOTARO;HORI TOSHIYASU;HIROSE SHIGEKAZU
分类号 H01L21/302;H01L21/461 主分类号 H01L21/302
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