发明名称 High-density nonvolatile memory and methods of making the same
摘要 Nonvolatile memory cells and methods of forming the same are provided, the methods including forming a first conductor at a first height above a substrate; forming a first pillar-shaped semiconductor element above the first conductor, wherein the first pillar-shaped semiconductor element comprises a first heavily doped layer of a first conductivity type, a second lightly doped layer above and in contact with the first heavily doped layer, and a third heavily doped layer of a second conductivity type above and in contact with the second lightly doped layer, the second conductivity type opposite the first conductivity type; forming a first dielectric antifuse above the third heavily doped layer of the first pillar-shaped semiconductor element; and forming a second conductor above the first dielectric antifuse.
申请公布号 US8383478(B2) 申请公布日期 2013.02.26
申请号 US201113195518 申请日期 2011.08.01
申请人 SANDISK 3D LLC;HERNER SCOTT BRAD;MAHAJANI MAITREYEE 发明人 HERNER SCOTT BRAD;MAHAJANI MAITREYEE
分类号 H01L21/336;G11C;G11C5/02;H01L21/00;H01L21/331;H01L21/82;H01L21/8238;H01L23/48;H01L27/102;H01L27/148;H01L29/94;H01L31/0392;H01L31/119 主分类号 H01L21/336
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