| 摘要 |
The invention provides an electronic part material which has a substrate produced by the Al alloy and a first coating formed on the surface of the substrate, wherein the Al alloy is carried out the annealing treatment, so the tensile strength of the Al alloy can reach to 200 to 300 MPa and the Vickers hardness Hv reaches to 65 to 100; and any one or more than two Ni, Ni alloy, Cu, Cu alloy, Ag, Ag alloy, Sn, Sn alloy, Pd, Pd alloy, Au, or Au alloy form the first coating. The electronic part material can replace the Cu alloy, so the light weight is realized, and the raw material cost is reduced. |
