发明名称 |
Liquid coolant conduit secured in an unused socket for memory module cooling |
摘要 |
An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit.
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申请公布号 |
US8385069(B2) |
申请公布日期 |
2013.02.26 |
申请号 |
US20100785779 |
申请日期 |
2010.05.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;IYENGAR MADHUSUDAN K.;KAMATH VINOD;MAHANEY, JR. HOWARD V.;STEINKE MARK E.;VALLURY APARNA |
发明人 |
IYENGAR MADHUSUDAN K.;KAMATH VINOD;MAHANEY, JR. HOWARD V.;STEINKE MARK E.;VALLURY APARNA |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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