发明名称 A LITHOGRAPHY MODEL FOR 3D TOPOGRAPHIC WAFERS
摘要 PURPOSE: A lithography model for 3D topographic wafers is provided to reduce operation costs by simulating an image in a resist layer of a substrate. CONSTITUTION: A substrate has features(250) in or under a resist layer. A substrate specific scattering function is determined using one or more scattering functions. The scattering functions are based on the properties of the features. The substrate specific scattering function specializes the scattering of incident radiation in the resist layer.
申请公布号 KR20130018626(A) 申请公布日期 2013.02.25
申请号 KR20120087336 申请日期 2012.08.09
申请人 ASML NETHERLANDS B.V. 发明人 LIU PENG
分类号 H01L21/027;G03F7/20 主分类号 H01L21/027
代理机构 代理人
主权项
地址