发明名称 Backlight Device with Light Emitting Diodes and Fabricating Method thereof
摘要 A backlight panel including LED(Light Emitting Diode)s and a manufacturing method thereof are provided to receive the complicated wiring for supplying driving signals to the LEDs. Plural LEDs are arranged flatly and mounted on a substrate(10). At least two or more metal pattern layers are arranged on the substrate and form the wiring so that driving signals are applied to the LEDs. At least one or more interfacial layers are arranged among at least two or more metal pattern layers. Plural contacts(18A) penetrate the interfacial layers so that the metal pattern layers are electrically connected with each other. The two or more metal patterns are stacked on the surface of the substrate. The substrate is made of metal and an insulation layer is additionally added between the substrate and the neighbor metal pattern layer.
申请公布号 KR101237115(B1) 申请公布日期 2013.02.25
申请号 KR20050129322 申请日期 2005.12.26
申请人 发明人
分类号 G02F1/13357 主分类号 G02F1/13357
代理机构 代理人
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