发明名称 Substrate of electric double layer capacitor (EDLC), Manufacturing method for substrate of EDLC, EDLC, Manufacturing method for EDLC, Assembly of Substrate of EDLC
摘要 The present invention relates to an electric double-layer capacitor. More specifically, the present invention relates to the electric double-layer capacitor provided with unit cells that are arranged inside a metal housing, which is integrally coupled to a printed circuit board. A lower plate for the electric double-layer capacitor, according to the present invention, comprises the printed circuit board and the metal housing, which is integrally coupled to the printed circuit board. The printed circuit board comprises an insulation layer, and a first metal layer and a second metal layer, which are coupled to the upper and lower surfaces of the insulation layer. A first current collection pattern and a second current collection pattern, which is electrically separated from the first current collection pattern, are formed on the first metal layer of the printed circuit board. A first terminal, which is connected to the first current collection pattern through a first via hole that is formed on the insulation layer, and a second terminal, which is connected to the second current collection pattern through a second via hole that is formed on the insulation layer, are formed on the second metal layer of the printed circuit board. The metal housing has a hollow cylindrical shape, is electrically connected to the first current collection pattern, is electrically separated from the second current collection pattern, and the inner circumferential surface or an extended surface of the inner circumferential surface of the metal housing encases the second current collection pattern. According to the present invention, a terminal can be easily mounted using surface mount technology without separately forming the terminal, due to the first and second terminals being formed on the lower plate of the electric double-layer capacitor.
申请公布号 KR101236890(B1) 申请公布日期 2013.02.25
申请号 KR20110045069 申请日期 2011.05.13
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址