METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS

摘要

PURPOSE: A method for preventing the growth of intermetallic compound is provided to react a solder foil film with a metal pad layer. CONSTITUTION: A substrate element is prepared(S101). At least one metal pad layer is laminated on a substrate(S201). At least one solder layer is laminated on the metal pad layer(S301). Intermetallic compound is formed on the solder layer(S401). A solder bump with proper thickness is laminated on the substrate element(S501). The substrate element is bonded to other parts by performing a bonding process(S600). [Reference numerals] (S101) Substrate; (S201) Laminating a metal pad layer; (S301) Laminating a solder layer; (S401) Forming intermetallic compound; (S501) Laminating a solder with proper thickness; (S600) Bonding process