| 摘要 |
A substrate processing apparatus is provided to strengthen adhesion of a resist in a photolithography and to reduce HMDS(Hexamethyldisilazane) consumption by improving processing amount of an adhesion process. A thermal process unit(26) prepares a flow transfer path(32) to a horizontal direction in parallel with a process line(A). A dehydration bake unit(DHP)(38), an adhesion unit(AD)(40), and a cooling unit(COL)(42) are installed along a transfer path from the upper side. The adhesion has an HMDS nozzle(98), an upper cover(100), and a lower cover(102). The HMDS nozzle is installed around an entrance of the adhesion unit. The upper cover is extended from a lower end of the HMDS nozzle to an exit of the adhesion unit to have a predetermined gap with respect to a substrate(G) on the transfer path. The lower cover is extended under the transfer path to face the HMDS nozzle and the upper cover. |
