APPARATO E PROCEDIMENTO PER LA LAVORAZIONE DI UN SUBSTRATO

摘要

An apparatus for processing a substrate includes an inspection system disposed in a first position to detect the location and orientation of the substrate supported on a supporting surface of a processing nest positioned in the first position and one or more processing heads disposed in the second and third positions and configured to perform a first and a second process on the substrate when the processing nest is moved to the second and third positions by an actuator assembly. A method for processing a substrate includes detecting the location and orientation of the substrate disposed on the processing nest which is positioned in the first position and aligning one or more processing heads to the substrate when the processing nest is positioned in the second and third positions and under the processing heads using data detected by an inspection system positioned in the first position.