| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which can form a solder resist with excellent flexibility and sufficiently reduced warping and repulsion and has good detachability from a support, and also provide a photosensitive element and a printed wiring board using the photosensitive resin composition. <P>SOLUTION: The photosensitive resin composition contains: a polyurethane compound having ethylenically unsaturated bonds; a compound having a structure represented by a specified formula (1-1); a photoinitiator; and a binder polymer having carboxyl groups. The added amount of the compound having the structure represented by the specified formula (1-1) is 5 to 25 mass%. [In the formula (1-1), R<SP POS="POST">1</SP>represents a tetravalent organic group.] <P>COPYRIGHT: (C)2013,JPO&INPIT |
