| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a residual stress measuring method for a thin plate capable of measuring residual stress and its distribution generated in an end surface part of a piece of a thin plate sheared off from the base material when the base thin plate is sheared. <P>SOLUTION: In a residual stress measuring method for a silicon steel plate, a base silicon steel plate 20 that is pinched is sheared by a punching process and the residual stress generated in steel plate moldings 21 separated from the base silicon steel plate 20 is measured. In the method, the orientation and position of sheared end parts 23 of the steel plate moldings 21 are aligned and neighboring steel plate moldings 21 are laminated to form a silicon steel plate laminate 10 made up of a plurality of steel plate moldings 21 the number of which satisfies a prescribed number. Then, a measurement range M needed for an X-ray stress measurement method is defined in a residual stress measurement range 11A of a silicon steel plate laminate end part 11, in which a plurality of sheared end parts 23 are arranged, of the silicon steel plate laminate 10, and the residual stress generated in the sheared end part 23 is measured by an X-ray stress measurement device 50. <P>COPYRIGHT: (C)2013,JPO&INPIT |
