| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cleaning method and a cleaning device which can clean a large number of wafers per unit time. <P>SOLUTION: A batch cleaning method for cleaning a plurality of semiconductor substrates once includes: a first step of transporting the semiconductor substrates in a state where the semiconductor substrates are held at predetermined intervals; a second step of sandwiching the semiconductor substrates between a plurality of roll brushes which are provided on each of front surfaces and rear surfaces of the semiconductor substrates and of which longitudinal directions are arranged in parallel with the front surfaces and the rear surfaces thereof; and a third step of cleaning the semiconductor substrates by rotating the roll brushes provided on each of the front surfaces and the rear surfaces. <P>COPYRIGHT: (C)2013,JPO&INPIT |
