| 摘要 |
<P>PROBLEM TO BE SOLVED: To maintain a bent state of a flexible printed circuit board having a bending part by suppressing the occurrence of a spring-back phenomenon by a coverlay and an adhesion layer. <P>SOLUTION: In a flexible printed circuit board having a bending part A, two coverlays 32, 34 mutually separated to sandwich the bending part A are formed. An ink print layer 50 having an excellent bending maintenance property is directly coated between the two coverlays on a circuit pattern layer 24. As such, by the formation of the ink print layer 50 between the two coverlays, an effect of maintaining a bent state is obtained by the ink print layer. In particular, since the reception of a physical influence such as a spring-back characteristic can be reduced when used in a portion adjacent to a junction part 24a with an isotropic conductive film, an adhered state to another conductive portion can be maintained, so that an effect capable of solving a problem such as an imperfect contact is produced. <P>COPYRIGHT: (C)2013,JPO&INPIT |
