MULTI-STEP AND ASYMMETRICALLY SHAPED LASER BEAM SCRIBING
摘要
Methods of dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating leading with a first irradiance and following with a second irradiance, lower than the first. Multiple passes of a beam adjusted to have different fluence level or multiple laser beams having various fluence levels may be utilized to ablate mask and IC layers to expose a substrate with the first fluence level and then clean off redeposited materials from the trench bottom with the second fluence level. A laser scribe apparatus employing a beam splitter may provide first and second beams of different fluence from a single laser.
申请公布号
WO2012173770(A3)
申请公布日期
2013.02.21
申请号
WO2012US39753
申请日期
2012.05.25
申请人
APPLIED MATERIALS, INC.;LEI, WEI-SHENG;EATON, BRAD;YALAMANCHILI, MADHAVA RAO;SINGH, SARAVJEET;KUMAR, AJAY;HOLDEN, JAMES M.
发明人
LEI, WEI-SHENG;EATON, BRAD;YALAMANCHILI, MADHAVA RAO;SINGH, SARAVJEET;KUMAR, AJAY;HOLDEN, JAMES M.