The invention relates to a method for manufacturing an MWT-PERC solar cell in which holes in the substrate of the solar cell are plated through, emitter regions on the back side of the solar cell are entirely removed using a diffusion process outside the via, and a dielectric layer is applied to the back side. In order not to affect the emitter on the front side when the emitter region on the back side is removed, a sacrificial layer that protects the emitter on the front side when the emitter regions on the back side of the solar cells are etched is formed on the front side, and/or a medium acting from the front side counteracts the etching effect of the etching medium penetrating the holes when the emitter regions on the back side are etched away.
申请公布号
WO2012143467(A3)
申请公布日期
2013.02.21
申请号
WO2012EP57201
申请日期
2012.04.19
申请人
SCHOTT SOLAR AG;MEYER, CHRISTINE;LACHOWICZ, AGATA;GASSENBAUER, YVONNE;BLENDIN, GABRIELE;MOSCHNER, JENS DIRK